Device Knowledge | Design Specification For Magnetic Ring Inductors (2)
2024-06-20 15:30:00
1. The number of manual winding layers of the magnetic ring is greater than or equal to 2 layers or the length of the line is equal to or equal to 2 meters, and the leather enamelled wire (PEW) design must be used. Try to use half winding method to prevent damage to the coating during winding.
2. The magnetic core and base of the common mode inductor must be fixed with glue to prevent the broken line of the magnetic ring rolling.3. The multi-wire winding of common mode inductors should consider the design of insulated wire + enamelled wire (UEW+TLW), or the design of peeling enamelled wire (PEW) to prevent poor voltage resistance.4. Common mode inductors, multi-wire and wound different windings should consider color differentiation, avoid winding cross, hanging wrong foot.5. For products without base/bottom plate, the PIN foot must be fixed with the magnetic ring to prevent the PIN distance from changing and cannot meet the requirements of the insert board.6.SMT chip inductor products, wire need to choose 180℃, to prevent SMT chip reflow welding, inductor due to the temperature of the wire is not enough SMT furnace temperature short circuit phenomenon; For plug-in products, the wire must meet the requirements of 155 ° C temperature rating.7. Requirements for foot wrapping and threading:Ø The 0.04 mm ≤ Copper wire diameter ≤ Ø 0.30mm, Each PIN wraps 2.0 ~ 3.0Ts;Ø The 0.30 mm < Copper wire diameter ≤ Ø 0.50mm, Each PIN wraps 1.5 ~ 2.0Ts around the foot;Ø The 0.50 mm < Copper wire diameter ≤ Ø 0.80mm, Each PIN is wrapped around the foot 1.0 ~ 1.5Ts;Ø The 0.80 mm < Copper wire diameter, each PIN is wrapped 0.8 ~ 1.0Ts.8. Chip inductor pin, terminal raw material preferably copper terminal or copper alloy (copper tin, copper zinc, copper nickel, etc.), It is forbidden to select iron-nickel alloy to prevent virtual welding and false welding.9. For the patch products with pins, L-shaped pins are preferred; Compared with a pin-free device, a pin-free device is preferred.10. Patch products, to meet the requirements of coplanarity, generally less than or equal to 0.15mm.
11. First dipping temperature requirements:Ø The 0.04 mm ≤ Wire diameter ≤ Ø 0.20mm, Tin furnace temperature: 370 ℃ Plus or minus 20 ℃ Soldering time: 2 ~ 3 seconds;Ø The 0.20 mm < Wire diameter ≤ Ø 0.50mm, Tin furnace temperature: 390 ℃ Plus or minus 20 ℃ Soldering time: 2 ~ 3 seconds;Ø The 0.50 mm < Copper wire diameter, tin furnace temperature: 390 ℃ Plus or minus 20 ℃ Soldering time: 3 ~ 4 seconds.
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